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1 Jan 2007 Process Technology: Wave and Selective Soldering Technology Assembly (DfA) guidelines and the development and adoption of new Selective Soldering Process Manual and Manufacturability Guideline . Reducing wave height to a minimum reduces dross generation. Nitrogen Inerting. One important factor in the selective wave solder process is the size of the selective pallet opening around the PTH pins. The recommended pallet opening can then be used to determine DFM guidelines for the component keep out from the PTH pins on the solder side of the board. selective soldering process. Advances in materials, with their ability to withstand the harsh environment of wave soldering and their ease of machining, have This document describes general guidelines and attention points for PCB design regarding selective soldering. The guidelines can be applied for. Select Wave Components should be placed at least .200" from the board edge. Minimize the number of through hole components to improve assembly efficiency and reduce labor costs. Ensure bottom side clearance between through hole lead and SMT devices for selective or wave soldering; preferred clearance is approximately .075". designed for wave soldering applications cannot fulfill. The design of fluxes for a selective soldering applications pose unique problems due to the localization Design Guidelines. For Manufacturing of Circuit Boards Design Guidelines exceet electronics. Version 9. Page 2 of 15 .. Selective Wave Soldering .In these cases, a selective wave soldering process is required. This is a to Pb-free, it is essential to establish DFM guidelines specifically for Pb-free soldering. 6 Oct 2016 Process Troubleshooting Guidelines . As a general guideline post-soldering cleanliness . For wave and selective soldering: lead dia. +.